14L 200kHz Ultrasonic Cleaner for Microchips Microoptics | China Supplier Digital Ultrasonic Bath with Low Noise Degas Sweep Pulse Mode

Product Features:

• 16 x 25kHz 200 Watts Transducers – 400 Watts Efficient
• Generous 14L Tank Capacity & Dimensions 30x24x20cm
• 1 – 9999s Digital Time Setting
• Heating Function Room Temperature – 80℃ Range
• Secure Wire Cleaning Mesh Basket
• Yunyisonic ultrasonic cleaner meets CE + RoHS + FCC (“Limit the use of certain hazardous substances”) standards and comes with a 1-year “Free Parts” warranty

Specification:

Box Contents:

1 x Professional Ultrasonic Cleaner
1 x Durable Mesh Cleaning Basket
One cover, one power cord, one manual warranty card certificate of conformity.

Packing type:

One unit filled with thick foam, then standard export corrugated carton or wooden box.

More Units

200kHz Series

Heater 20–80°C · Timer 1–9999s · SUS304 Unit

14L Series

Heater 20–80°C · Timer 1–9999s · SUS304 Unit

Why Choose Our 14L 200kHz Ultrasonic System

Product Highlights

• 200kHz Ultrasonic Frequency: Targets ultra-fine contamination on fragile components without erosion or etching
• Degas, Sweep & Pulse Functions: Enhance uniformity, eliminate gas bubbles, and improve penetration in narrow gaps
• Digital Control Panel: Real-time power and timer adjustment with optional multi-language interface
• Low-Noise Structure: Designed to minimize lab disruption in shared workspaces
• Premium SUS304 Tank (1.5mm Thick): Corrosion-resistant, durable, and compatible with mild solvents
• 14L Capacity: Ideal for cleaning micro-optical components, longer fiber ends, or clusters of MEMS sensors
• OEM & Custom Support: We offer logo printing, functional tuning, and tailored circuit integration for specialized lab applications
• Fast Global Delivery: Export-ready, with CE/FCC/RoHS certifications and full customs documentation

YL Ultrasonic Cleaner Typical Applications

• Our ultrasonic cleaning system is validated across both academic laboratories and industrial environments, delivering reliable results in micro-scale decontamination and surface preparation. It supports a wide range of critical workflows, including:
  Surface cleaning of silicon wafers, thin-film substrates, and semiconductor dies
• Contaminant removal in MEMS fabrication, microfluidics, and integrated photonic device prototyping for IC bonding, lithography processes, and post-etch residue clearance
• Routine maintenance in R&D labs, university cleanrooms, and small-batch pilot production lines